Foundations and Trends® in Electronic Design Automation > Vol 8 > Issue 2

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Mohamed M. Sabry, Embedded Systems Lab (ESL), Ecole Polytechnique Fédérale de Lausanne (EPFL), Switzerland, mohamed.sabry@epfl.ch David Atienza, Embedded Systems Lab (ESL), Ecole Polytechnique Fédérale de Lausanne (EPFL), Switzerland, david.atienza@epfl.ch
 
Suggested Citation
Mohamed M. Sabry and David Atienza (2014), "Temperature-Aware Design and Management for 3D Multi-Core Architectures", Foundations and Trends® in Electronic Design Automation: Vol. 8: No. 2, pp 117-197. http://dx.doi.org/10.1561/1000000032

Published: 27 Jan 2014
© 2014 M. M. Sabry and D. Atienza
 
Subjects
System Level Design
 

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In this article:
1. Introduction
2. Thermal Modeling for 3D MPSoCs
3. Temperature-Aware Design Optimizations for 3D MPSoCs
4. Temperature-Aware Runtime Management for 3D MPSoCs
5. Conclusion
Acknowledgements
References

Abstract

Vertically-integrated 3D multiprocessors systems-on-chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs incur amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies, alongside temperature-aware design-time optimizations and run-time management schemes have been proposed. In this paper, we provide an overall survey on the recent advances in temperature-aware 3D MPSoC considerations. We explore the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. Our aim of proposing this survey is to provide a global perspective, highlighting the advancements and drawbacks on the recent state-of-the-art.

DOI:10.1561/1000000032
ISBN: 978-1-60198-774-7
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Table of contents:
1. Introduction
2. Thermal Modeling for 3D MPSoCs
3. Temperature-Aware Design Optimizations for 3D MPSoCs
4. Temperature-Aware Runtime Management for 3D MPSoCs
5. Conclusion
Acknowledgements
References

Temperature-Aware Design and Management for 3D Multi-Core Architectures

Vertically-integrated 3D Multiprocessor Systems-on-Chip (3D MPSoCs) provide the means to continue integrating more functionality within a unit area while enhancing manufacturing yields and runtime performance. However, 3D MPSoCs are subject to amplified thermal challenges that undermine the corresponding reliability. To address these issues, several advanced cooling technologies alongside temperature-aware design-time optimizations and run-time management schemes have been proposed.

Temperature-Aware Design and Management for 3D Multi-Core Architectures surveys recent advances in temperature-aware 3D MPSoC considerations. It explores the recent advanced cooling strategies, thermal modeling frameworks, design-time optimizations, and run-time thermal management schemes that are primarily targeted for 3D MPSoCs. As such, it provides a global perspective, highlighting the advancements and drawbacks of the recent state-of-the-art. While the primary focus is on existing methodologies and techniques, it also provides some insights on possible future directions related to this research discipline – temperature-aware design and management.

Temperature-Aware Design and Management for 3D Multi-Core Architectures is an ideal primer for researchers and practitioners working in this area.

 
EDA-032